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MCG Reports

Cost Modeling of Display Technologies Utilizing CMOS Backplanes
(Integrated Circuit Backplane Costs for 11 Alternative Designs)
by David Armitage, Steve Jurichich, Charles McLaughlin and Larry Ragle

___________________________________________________

Table of Contents

I. Introduction and Scope

6

II. Cost Model Methodology

8

Introduction

8

Incremental process Cost

9

Process Yield Methodology for Wafer Processing

12

III. CMOS Process Flows

14

CMOS Process General Considerations

14

Yields and Defect Densities of CMOS Processing

18

IV. Display Process Flows

20

Introduction

20

1. Silicon Light Machines GLV

21

2. Hertz Institute Deformable Mirror

25

3. Texas Instruments Digital Micromirror Device

26

4. Displaytech FLC

28

5. Spatialight c-Si LCD

31

6. MicroDisplay c-Si LCD

32

7. Kopin x-Si LCD

34

8. Seiko-Epson p-Si LCD

34

9. Raychem/Hitachi PDLC

35

10. Planar Systems AMEL

35

11. Micron Technology FED

37

V. Die Cost Comparisons of Display Technologies

41

VI. Spreadsheet Cost Model Summaries

44

VII. Cost Sensitivity to Wafer process Flows and Yield Assumptions

55

VIII. Miniature Imaging Device Module Costs Compared

61

References

64

Appendix

66

Return to the summary - Miniature Imager Costs
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