MCG Reports
Cost Modeling of Display Technologies Utilizing CMOS Backplanes
(Integrated Circuit Backplane Costs for 11 Alternative Designs)
by David Armitage, Steve Jurichich, Charles McLaughlin and Larry Ragle
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Table of Contents
I. Introduction and Scope |
6 |
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II. Cost Model Methodology |
8 |
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Introduction |
8 |
||
Incremental process Cost |
9 |
||
Process Yield Methodology for Wafer Processing |
12 |
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III. CMOS Process Flows |
14 |
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CMOS Process General Considerations |
14 |
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Yields and Defect Densities of CMOS Processing |
18 |
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IV. Display Process Flows |
20 |
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Introduction |
20 |
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1. Silicon Light Machines GLV |
21 |
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2. Hertz Institute Deformable Mirror |
25 |
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3. Texas Instruments Digital Micromirror Device |
26 |
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4. Displaytech FLC |
28 |
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5. Spatialight c-Si LCD |
31 |
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6. MicroDisplay c-Si LCD |
32 |
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7. Kopin x-Si LCD |
34 |
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8. Seiko-Epson p-Si LCD |
34 |
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9. Raychem/Hitachi PDLC |
35 |
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10. Planar Systems AMEL |
35 |
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11. Micron Technology FED |
37 |
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V. Die Cost Comparisons of Display Technologies |
41 |
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VI. Spreadsheet Cost Model Summaries |
44 |
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VII. Cost Sensitivity to Wafer process Flows and Yield Assumptions |
55 |
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VIII. Miniature Imaging Device Module Costs Compared |
61 |
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References |
64 |
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Appendix |
66 |
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Return to the summary - Miniature Imager Costs
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